Yunnan Tin Company Limited (000960)

Overview

Yunnan Tin Company Limited, founded in 1883 and headquartered in Kunming, China, stands as a leading entity in the realm of tin production and processing. With its vast operations chiefly situated within China, the company has also established a significant presence on the global stage through the export of its diverse product range. Specializing in the development, manufacture, and distribution of a wide array of tin-related products, Yunnan Tin Company Limited caters to various industrial requirements, underpinning its stature as a pivotal player in the tin industry.

Products and Services

• Tin Ingots: High-purity tin used as a raw material in various industrial applications, including electronics and specialized manufacturing processes.
• Special Tins for Float Glass Production: Tailored tin products designed specifically for the production of float glass, thereby enhancing the quality and efficiency of glass manufacturing.
• Bearing Alloy Ingots: Ingots made from tin and other metals, crucial for the production of bearings used in machinery and automotive industries.
• Lead-Based Alloys: Alloys primarily composed of lead and tin, utilized in various applications like batteries and cable sheathing.
• Tin-Lead Wire Solders: These solders are essential for joining metal parts in electronics and plumbing, offering reliable conductivity and durability.
• Zinc and Tin Zinc Alloy Wires: Wires used for their anti-corrosion properties, especially in the automotive and electronics industries.
• Lead-Free Solder Wires and Bars: Environmentally friendly alternatives to traditional soldering materials, crucial for electronic component assembly.
• Casting Solder Bars, Extruder Solder Bars: Specialized forms of solder used in the casting process and extrusion techniques, facilitating various manufacturing processes.
• Tin Granules, Tin Balls: Small, refined pieces of tin used for alloying and in chemical processes.
• Spherical Solder Powders: These powders are crucial for creating solder paste used in the assembly of electronic components.
• Ball Grid Array Solder Balls: Specifically designed for the assembly of ball grid array packages, enhancing the reliability of semiconductor devices.
• Tin and Solder Anodes: Anodes made from tin or tin alloys, used in electroplating and electronics manufacturing.
• Lead-Free Solder Pastes, Low-Temperature Solder Pastes, Eutectic Solder Pastes: These pastes are specifically formulated for various soldering applications, meeting different melting point requirements and industry standards.
• Copper Cathode Products: High-purity copper produced through the electrolytic refining process, widely used in electrical applications.
• Tin Chemicals: A range of chemical compounds containing tin, used in industrial processes and as catalysts in organic synthesis.
• Indium and Silver Ingots: Pure metals used in a variety of high-tech applications, including semiconductors and solar panels.
• Organic and Inorganic Tin Chemicals: These chemicals find applications in industrial processes, including as stabilizers and catalysts.