HannStar Board Corp. (5469)

Overview

HannStar Board Corporation is a distinguished manufacturer, assembler, and seller of printed circuit boards (PCBs) based in Taiwan. Originating in 1989 under the name Pacific Science and Technology Industrial Co., Ltd., the company underwent a rebranding in December 1998 to become known as HannStar Board Corporation. With its headquarters in Taoyuan, Taiwan, HannStar has carved out a significant presence in the global market by providing innovative PCB solutions. Catering to a diverse range of industries including gaming, consumer electronics, computing, automotive, and networking, the company has established itself as a leader in the PCB manufacturing domain.

Products and Services

• Double-Sided PCBs

These are PCBs with circuits on both sides, offering flexibility in design and more circuitry in a smaller space. They are widely used across various applications owing to their versatility and efficiency.

• Multi-Layer PCBs

Comprising several layers of circuit boards stacked together, these PCBs are designed for complex applications requiring high-speed circuitry, large capacity, and small form factors. They are essential in computing, communication devices, and advanced consumer electronics.

• Thick Copper PCBs

These PCBs are characterized by their thick copper conductors, which are ideal for high power distribution applications, such as in industrial controls, automotive power systems, and power supply modules. The thick copper layer ensures robust current carrying capacity and heat dissipation.

• High-Density Interconnect (HDI) PCBs

HDI PCBs are known for their high-density attributes, including finer lines and spaces, smaller vias, and higher connection pad density. This technology enables more advanced features in a smaller area, critical for modern high-tech devices like smartphones and wearable technologies.

• SLC Multi-Layer PCBs

Standing for Sequential Lamination Construction, these multi-layer PCBs are built by sequentially laminating layers of circuits on top of each other. This process allows for higher component density and better electrical performance, making them suitable for high-end servers, network equipment, and complex consumer electronics.