CPIA

CHIPMOS TECH.ADR 20 TA10 (CPIA)

Market Closed
20 Dec, 20:00
XBER XBER
18. 00
-0.1
-0.55%
23.28B Market Cap
17.68 P/E Ratio
4.45% Div Yield
0 Volume
0 Eps
18.1
Previous Close
Day Range
18 18
Year Range
17.3 28.6
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CHIPMOS TECH.ADR 20 TA10 Profile

Semiconductors Industry
Technology Sector
Mr. Shih-Jye Cheng CEO
XBER Exchange
US16965P2020 ISIN
Germany Country
- Employees
27 Jun 2024 Last Dividend
31 Oct 2016 Last Split
- IPO Date

Overview

ChipMOS TECHNOLOGIES INC. is a prominent player in the semiconductor industry, focusing on the research, development, manufacturing, and sale of high-integration and high-precision integrated circuits, alongside offering related assembly and testing services. Established in 1997 and based in Hsinchu, Taiwan, the company serves a global market, including key regions such as the People's Republic of China, Japan, Singapore, and other international territories. ChipMOS operates across various segments, including Testing, Assembly, Testing and Assembly for LCD, OLED, and Other Display Panel Driver Semiconductors, Bumping, and Others, catering to a wide range of needs in the semiconductor sector.

Products and Services

Engineering Test, Wafer Probing, and Final Test of Memory and Logic/Mixed-Signal Semiconductors: These services cover the comprehensive testing needs of memory and logic/mixed-signal semiconductors, ensuring their performance and reliability before they are deployed in the market. ChipMOS's expertise includes initial engineering tests, intricate wafer probing to check for defects at an early stage, and thorough final testing.

Leadframe-Based and Organic Substrate-Based Package Assembly Services for Memory and Logic/Mixed-Signal Semiconductors: ChipMOS provides advanced packaging solutions, utilizing both leadframe-based and organic substrate-based methods for assembling memory and logic/mixed-signal semiconductors. These services are critical for preparing semiconductors for final application by ensuring robust physical protection and reliable electrical connections.

Gold Bumping, Reel to Reel Assembly, and Test Services for LCD, OLED, and Other Panel Display Driver Semiconductors: Specializing in display technologies, ChipMOS offers gold bumping services that are essential for LCD, OLED, and other display panels. Their reel to reel assembly and testing services ensure that display driver semiconductors meet the strict requirements for quality and performance in today's high-definition displays.

The semiconductors produced and serviced by ChipMOS are utilized in a broad spectrum of applications, from personal computing devices and graphic applications including game consoles to communications equipment, mobile products like cellular handsets and tablets, consumer electronics, automobile/industry equipment, and advanced display panels. This wide range of applications underscores ChipMOS's role in supporting the backbone of modern digital infrastructure.

Contact Information

Address: No.1, Yanfa 1st Road, Hsinchu City, Taiwan
Phone: 886 3 577 0055